In data center power distribution solutions, PDUs play a critical role. When customers purchase a 120A PDU, they may notice that the number of outlets varies widely across models, some offering as many as 48 outlets. But does a higher outlet count mean better performance? Not necessarily.

Data centers are shifting from “power safety” to a new stage of operational safety, information transparency, and intelligent automated Operation & Maintenance.

During this transformation, sensors have become the data center's “sensory system.” Working together with PDUs, they allow operators to monitor cabinet-level conditions and asset status in real time, improving both reliability and energy efficiency.

As AI models continue to scale up and demand for high-performance computing surges, the form factor and deployment methods of data center servers are undergoing profound changes. Traditional standard servers, mainly 1U/2U , are gradually being replaced by large AI servers in the 4U–10U range, such as NVIDIA’s DGX series platform. This evolution trend poses new challenges to power distribution systems.

In high-performance computing, a chip’s heat generation is often compared to a miniature sun. A fingertip-sized silicon die can dissipate over a kilowatt of power, a phenomenon defined by heat flux density.
When heat flux approaches or exceeds 100 W/cm², conventional cooling methods start to fail. To sustain the growth of computing power, we must seek systematic breakthroughs in thermal design, and the key lies in structural innovation.